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PS MLEM BLBX IC – BGA Replacement IC for Mobile Phone Motherboard Repair

PS MLEM BLBX IC – High Quality BGA IC

The PS MLEM BLBX IC is a precision BGA (Ball Grid Array) component designed for mobile phone motherboard repair and electronic circuit replacement applications. This compact IC features a black package with clearly identifiable PS MLEM BLBX markings and a 24-point BGA solder ball arrangement. Its compact construction and precisely arranged solder contacts make it suitable for professional motherboard-level repair work. Designed for technicians working with advanced mobile phone repair, this component can be used for compatible PCB replacement and BGA rework applications. Proper identification and compatibility verification are recommended before installation to ensure reliable operation.

Key Features

• High-quality BGA electronic component

• Clearly identifiable PS MLEM BLBX marking

• Compact black IC package

• 24 visible BGA solder ball contacts

• 6 × 4 contact arrangement as shown

• Precision BGA connection design

• Suitable for motherboard-level repair

• Designed for professional IC replacement

• Compatible with appropriate BGA soldering techniques

• Ideal for mobile phone repair technician

  Description

  PS MLEM BLBX IC – BGA IC for Mobile Repair

  The PS MLEM BLBX IC is a BGA replacement IC for mobile phone motherboard repair. It has a black package with the marking PS / MLEM / BLBX and 24 visible solder ball contacts in a 6 × 4 layout. It is supplied for BGA rework and soldering.

  Specifications

  Product Name PS MLEM BLBX IC
  Component Type BGA IC
  Chip Marking PS / MLEM / BLBX
  Package Type BGA
  Contact Count 24 visible balls
  Contact Layout 6 × 4
  Package Colour Black
  Application Mobile Motherboard Repair
  Installation BGA Rework / Soldering
  Product Category Mobile Repair IC

  Compatible Brands & Models

  • INFINIX: Hot 10i (X659), Smart 3 (X5516), Smart 3 (X5516B), X689

  • ITEL: A90, Power 70 (P673L), S11 Pro

  • LAVA: Agni 4 (LXX525)

  • NOKIA: C3 (TA-1292)

  • SAMSUNG: SM-Book 10.6 (W620)

  • TECNO: Camon 11 Pro (CF8), Camon 17 (CG6), Camon 17 (CG6J), Camon Click (ID6), Camon CM (CA6), Camon i 2X (ID5B), Camon i Sky (IN2), Camon i Sky 3 (KB3), Camon i2 (ID5A), Camon i4 (CB7), Camon i4 (CB7J), Camon Sky (IN1 Pro), KF7J, Pop 6 Pro (BE8), Pouvoir 3 (LB7), RA8, Spark 2 (KA7), Spark 4 Air (KC1J), Spark 6 Go, Spark 7 Pro (KF8), Spark Go (KC1H), Spark Go 2020, Spark Go Plus, T453

  • XIAOMI: Poco M4 Pro 5G, Poco X3 GT, Redmi Note 11T 5G

  • ZTE: Blade A36, Blade A56, Nubia A36

  Applications

  • Mobile phone motherboard repair

  • BGA IC replacement

  • Electronic circuit board servicing

  • Professional mobile repair workshops

  • Motherboard-level troubleshooting

  Installation Information
  Professional BGA rework equipment and appropriate soldering techniques are recommended. Technicians should verify the IC identification, PCB footprint and circuit compatibility before installation.

  Buy PS MLEM BLBX IC online at MOBILEIC.IN – your destination for mobile phone repair spare parts.