SAM1301 AUDIO IC
(Product Summary) Original replacement SMA1301 Audio Power Amplifier IC in a pre-balled 20-pin (4×5) WLCSP/BGA package. Verified by Borneo Schematics for board-level micro-soldering across Samsung Galaxy A, F, and M series models, iPhone XS, LG G8 ThinQ, and Infinix Smart 8 to fix no-ringer sound, speaker distortion, and audio line short circuits.
₹290.00
SAM1301 AUDIO IC

Product Title SMA1301 Smart Audio Amplifier IC – 20-Ball Ringer & Speaker Power IC for Samsung Galaxy A/F/M Series, iPhone XS, LG G8 ThinQ & Infinix Smart 8
Full Product Description The SMA1301 is a compact Class-D Smart Audio Amplifier IC that drives loudspeaker and ringer outputs on mobile motherboards. It comes with pre-tinned solder balls in a 4×5 matrix, allowing clean reflow installation without manual reballing. Based on Borneo Schematics part compatibility data, this IC supports a wide range of smartphones. It fits Samsung Galaxy A series models including SM-A10 (A105), SM-A10E (A102), SM-A12 (A125), SM-A12S (A127), SM-A15 5G (A156E), SM-A17 (A175F), SM-A20 (A205), SM-A20E (A202), SM-A21S (A217), SM-A24 (A245), SM-A30 (A305), SM-A30S (A307), SM-A31 (A315), SM-A32 (A325), SM-A40 (A405), and SM-A41 (A415). It also works with Samsung Galaxy F series models SM-F13 (E135), SM-F14 (E146), and SM-F15 (E156), plus Samsung Galaxy M series models SM-M12 (M125), SM-M13 (M135), SM-M14 5G (M146B), and SM-M15 (M156), alongside Infinix Smart 8, Apple iPhone XS (IP-XS), and LG G8 ThinQ.
Supported & Compatible Models (Borneo Schematics Verified)
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Samsung Galaxy A Series: SM-A10 (A105), SM-A10E (A102), SM-A12 (A125), SM-A12S (A127), SM-A15 5G (A156E), SM-A17 (A175F), SM-A20 (A205), SM-A20E (A202), SM-A21S (A217), SM-A24 (A245), SM-A30 (A305), SM-A30S (A307), SM-A31 (A315), SM-A32 (A325), SM-A40 (A405), SM-A41 (A415).
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Samsung Galaxy F Series: SM-F13 (E135), SM-F14 (E146), SM-F15 (E156).
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Samsung Galaxy M Series: SM-M12 (M125), SM-M13 (M135), SM-M14 5G (M146B), SM-M15 (M156).
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Apple iPhone: iPhone XS (IP-XS).
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Infinix: Smart 8.
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LG: G8 ThinQ.
Technical Specifications
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Model Number: SMA1301.
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Component Type: Smart Audio / Loudspeaker / Ringer Power Amplifier IC.
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Package Layout: 20-Ball WLCSP BGA (4 columns x 5 rows configuration).
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Chip Markings: SMA1301 (lot codes such as HJWE, N60N, and AeAu N may vary by batch).
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Solder Terminals: Factory pre-balled pads ready for direct SMD/BGA mounting.
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Distributor: www.mobileic.in (Contact: 9895333473).
Common Faults Resolved
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Dead Loudspeaker Output: Restores ringtone and media audio when the speaker and flex cable test normal.
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Audio Distortion: Fixes crackling, low volume, or sound cutting out during speakerphone and media playback.
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Motherboard Audio Shorts: Replaces damaged or shorted audio ICs causing high current draw on the power rail.
Installation Guidelines
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Orientation Check: Align the top-left Pin-1 mark above the SMA1301 engraving with your board layout before reflowing.
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Soldering Profile: Use controlled hot-air heat and BGA flux to avoid solder bridges across the 20-ball array.


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