MT6625LN IC FOR WIFI AND BLUETOOTH CONNECTIVITY
The MediaTek MT6625LN is a high-integration 4-in-1 wireless connectivity System-on-Chip (SoC) engineered for MediaTek-based smartphones and tablets. Housed in a compact 40-pin QFN (Quad Flat No-leads) SMD package with a large central exposed thermal ground pad, this single chip consolidates four essential wireless subsystems—Wi-Fi, Bluetooth, GPS/GNSS satellite navigation, and FM radio—into one space-saving silicon die.
In modern smartphone motherboards, the MT6625LN serves as the primary RF connectivity hub communicating directly with the main application processor (CPU) and power management IC (PMIC). Liquid ingress, power surges, drop-induced solder joint cracks, or internal RF power amplifier burnout frequently cause this IC to fail or develop a partial short circuit. Replacing the damaged component with a fresh MediaTek MT6625LN restores full wireless networking, peripheral pairing, and location accuracy without requiring a costly motherboard swap.
₹200.00
MT6625LN IC FOR WIFI AND BLUETOOTH CONNECTIVITY

MediaTek MT6625LN 4-in-1 Wi-Fi, Bluetooth, GPS & FM Wireless Connectivity IC (QFN-40)
Product Overview
The MediaTek MT6625LN is a high-integration 4-in-1 wireless connectivity System-on-Chip (SoC) engineered for MediaTek-based smartphones and tablets. Housed in a compact 40-pin QFN (Quad Flat No-leads) SMD package with a large central exposed thermal ground pad, this single chip consolidates four essential wireless subsystems—Wi-Fi, Bluetooth, GPS/GNSS satellite navigation, and FM radio—into one space-saving silicon die.
In modern smartphone motherboards, the MT6625LN serves as the primary RF connectivity hub communicating directly with the main application processor (CPU) and power management IC (PMIC). Liquid ingress, power surges, drop-induced solder joint cracks, or internal RF power amplifier burnout frequently cause this IC to fail or develop a partial short circuit. Replacing the damaged component with a fresh MediaTek MT6625LN restores full wireless networking, peripheral pairing, and location accuracy without requiring a costly motherboard swap.
Key Features & Highlights
- 4-in-1 Wireless Integration: Combines Wi-Fi transceiver, Bluetooth baseband/RF, GPS/GNSS receiver, and FM radio tuner in a single monolithic IC.
- Precision QFN-40 Footprint: Features 40 perimeter contact pads (10 pins per side) with a wide central ground slug for superior heat dissipation and RF shielding.
- OEM-Grade Replacement: Direct pin-to-pin replacement for factory-installed MT6625LN chips across dozens of popular smartphone brands.
- Low Power & Stable RF Performance: Engineered to eliminate intermittent signal drops, high standby current draw, and thermal throttling in the connectivity section.
- Technician-Ready Component: Clean perimeter leads and flat bottom thermal pad allow smooth alignment and reliable reflow on mobile PCBs.
Technical Specifications
| Parameter | Specification |
| Brand / Manufacturer | MediaTek |
| Part Number | MT6625LN |
| Top Chip Markings | MEDIATEK / MT6625LN / 1904-AJCJL / BAP1M056 / ATG3CV50 |
| Package / Case Type | QFN-40 (40-Pin Quad Flat No-Leads with Exposed Center Ground Pad) |
| Integrated Subsystems | Wi-Fi, Bluetooth, GPS / GNSS Navigation, FM Radio |
| Mounting Style | Surface-Mount Device (SMD / SMT) |
| Pin-1 Orientation | Indicated by bottom-left circular dot marker on IC top surface |
| Primary Application | Mobile Phone & Tablet Motherboard Chip-Level Repair |
Common Hardware Faults Resolved by Replacing MT6625LN
Installing a replacement MT6625LN resolves the following motherboard-level hardware symptoms:
- Wi-Fi Grayed Out or Stuck Turning On: The Wi-Fi toggle switch in settings remains unresponsive, turns back off immediately, or fails to scan available routers.
- Bluetooth Activation & Pairing Failure: Bluetooth refuses to switch on, fails to discover nearby headsets/devices, or disconnects repeatedly within short distances.
- Weak Wi-Fi / Bluetooth Signal Range: Device only detects networks when placed directly next to the router due to a damaged internal RF front-end or LNA stage.
- GPS / Location Lock Failure: Navigation apps fail to lock onto satellites, show inaccurate coordinates, or lose signal continuously outdoors.
- Dead FM Radio: FM radio app fails to initialize hardware or produces static with zero station reception.
- Motherboard Short & Overheating: Abnormal current draw on DC power supply before or after boot, rapid battery drain, or localized heating around the Wi-Fi IC shield when probed with thermal imaging or rosin flux.
Verified Compatible Smartphone & Tablet Models
The MediaTek MT6625LN is confirmed compatible across a wide range of smartphones and tablets from the following brands:
- Alcatel: 3 (5052D), 3X (2019), Flash 2 (7049D), Flash Plus 2
- Asus: 3 Max (ZC520TL), Max Plus M1, Zen 3 Max (ZC520TL)
- Coolpad: N3C, Note 3 Lite
- Elephone: U Pro
- Gionee: A1, A1 Plus, P7, Pioneer (P5L)
- Hotwav: Pearl K2, Pearl K2 (2020), Pearl K3, Pearl M5, R60, Symbol Max
- Huawei: GR3, Honor 7S, Honor Holly 2 Plus, Y3 (2017), Y5 2017, Y5 ii, Y5 Prime
- Infinix: H538, Hot 4 Pro (X556), Note 2 (X600), Note 3 (X601), Note 3 Pro, Note 4 (X572), Note 5 Stylus (X605), S2 Pro (X522), S2 Pro (X552), Smart 2 (X5515), Smart 2 Pro (X5514), Zero, Zero 2 (X509), Zero 4 (X555), Zero 5 (X603)
- InFocus: IF9029, M350, M460, M535, M680
- Itel: A43, A44, A62, IT1512
- Lava: Benco V60, Benco V8, R1 Lite, Z91
- Lenovo: A2010, A5 (L18021), A7000-A, A7700, C2 Power, K5 (K350T), K5 (K30T), P70, Phab 2, Tab 7 (TB-7304), Vibe B, Vibe C2, Vibe P1m, Vibe S1
- LG: K10, K10 Single, K4 (K120), K8 (K350), K8 (X240) 2017, LM-X410BCW, X Power 2 (M320)
- Meizu: M2 Mini, M2 Note, M3, M3 Note, M5, M5 Note, M5C, M6, M6T, Pro 7, U20
- Micromax: Canvas Unite 4 (Q427)
- Motorola: Moto E3 Power, Moto E4 Plus, Moto E6 Play, Moto K6
- Neffos: C7 Lite, X9
- Nokia: 1 (TA-1047), 1 Plus (TA-1130), 3
- Oppo: A37 MTK, F3, F5, F5 Youth
- Samsung: SM-A01 Core (A013), SM-A02 (A022), SM-J2 Prime (G532), SM-J7 Max (G615), SM-M02 (M022)
- Sharp: A2 Lite
- Sony: Xperia C5 Ultra
- Tecno: C5-H351, C7-H355, C8-H352, C9-H535, Camon 11 (CF7), Camon 11 (CF7S), Camon C7, Camon C8, Camon C9, Camon CM (CA6), Camon CX Air, Camon i Ace (IN1), Camon i Sky (IN2), Camon i2 (ID5 / Tecno ID5), Camon IN5, Camon Sky (IN1 Pro), Camon X (CA7), Camon X Pro (CA8), DP10A-PA01, DP8D-PA02, F2 LTE, F4, F4 Pro, J8-H354, N8-N8S-H356, N8S, N9, P702, P904-PA05, Phantom 8 (AX8), Pop 4 LTE (BC1S), Pop 6 (BE7), Pop 6 Go (BE6J), Pop 6 Pro (BE8i), Pouvoir 3 (LB7), PP7F Pro, R80, R8S, RA6, RC6, W3 LTE-H356, W5-H373, WX4Pro
- Umidigi: One Pro, S2
- Vestel: Venus Z30
- Vivo: V5, V5 Lite, V5s, Y69
- ZTE: Blade A2, Blade A2S, Blade V7 Lite, Blade V7 Plus, Nubia M2 Lite, Nubia N1 Lite, Nubia N2 Lite
Technician Compatibility Note: Certain smartphone models are released in different regional or hardware board revisions (e.g., MediaTek vs. Qualcomm variants). Always inspect the silkscreen marking on the original motherboard chip and verify MT6625LN before ordering.
Technician Diagnosis & Micro-Soldering Guidelines
- Pre-Replacement Checks: Before removing the IC, verify that input supply rails (VBAT / VSYS and VIO18_PMU) and the 26 MHz system clock signal are reaching the MT6625LN circuit without shorted decoupling capacitors.
- ESD Safe Handling: Always handle the QFN-40 IC using anti-static (ESD-safe) precision tweezers on a grounded mat to protect sensitive RF input/output pins.
- PCB Pad Preparation: Clean residual factory solder from all 40 perimeter pads and the central ground pad using low-melt solder and desoldering wick. Avoid applying excess solder to the center ground slug, as too much solder will float the IC and prevent the outer 40 pins from making contact.
- Pin-1 Alignment: Apply a thin, even layer of high-grade tacky flux and align the circular Pin-1 dot on the MT6625LN with the Pin-1 orientation mark on the motherboard.
- Controlled Hot-Air Reflow: Use a calibrated hot-air rework station with low-to-medium airflow so surrounding 0201 RF capacitors, inductors, and filters are not blown out of position.
- Post-Soldering Inspection: Allow the motherboard to cool naturally to room temperature, clean flux residue with isopropyl alcohol (IPA), and inspect every perimeter solder fillet under a stereo microscope for bridges or cold joints before connecting the battery.
Quality Assurance & Packaging
- Physical Inspection: Every MT6625LN IC is visually verified under magnification for clean, unoxidized perimeter contacts, intact body edges, and crisp laser markings prior to dispatch.
- Secure Transit Packaging: Shipped in protective ESD-safe tape/tray and cushioned packaging to prevent bent corners, moisture exposure, or electrostatic damage during transit.
Frequently Asked Questions (FAQ)
Q1. What functions does the MT6625LN control on a mobile motherboard? The MT6625LN is a 4-in-1 connectivity IC responsible for Wi-Fi, Bluetooth, GPS/GNSS navigation, and FM radio functionality. A fault in this single IC can disable one or all four features simultaneously.
Q2. Does the MT6625LN require reballing before installation? No. Because the MT6625LN uses a QFN-40 package (flat perimeter leads and a center thermal pad rather than BGA solder balls), it only requires tinning the motherboard pads lightly with fresh solder paste/flux before hot-air reflow.
Q3. My phone’s Wi-Fi and Bluetooth both stopped working after water damage. Will replacing MT6625LN fix it? If corrosion or a short circuit occurred under the Wi-Fi IC and the power supply lines from the PMIC are intact, cleaning the corroded pads and installing a new MT6625LN will restore both Wi-Fi and Bluetooth.
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